Nobleo Technology

From start-ups to multinationals, Nobleo High Tech Systems delivers high-precision motion solution modules for innovative industries like semiconductor manufacturing and printing. Our systematic approach, the Nobleo Design Core, ensures transparency, co-creation and true partnerships throughout the product development process.

How do you ensure defect-free photonic integrated circuits (PICs) at scale? Nobleo Technology plays an important role in Semicon 08, a project focused on developing advanced inspection and testing solutions for photonic chips. As a partner from NXTGEN Hightech, we designs machine learning algorithms for surface inspection, wafer alignment and defect detection. Our work improves the accuracy and efficiency of photonic wafer production. 💡 Our expertise: ✔ Machine learning-based defect detection ✔ High-speed wafer scanning ✔ Precision alignment algorithms ✔ Development of hardware and software solutions for defect inspection Nobleo’s solutions support the quality control of photonic wafers, ensuring accurate defect detection and efficient wafer inspection. With expertise in machine learning and high-speed scanning, we contribute to improved semiconductor manufacturing processes. 📖 Read the full partner story to learn more about how we outsmart tomorrow in this project! https://lnkd.in/eJV5cNpf #Semiconductors #Mechatronics #NXTGENHighTech #brainport #photonicintegratedcircuits

For the second year in a row, BESI Singapore Pte Ltd has honored Nobleo Technology and Nobleo Manufacturing with a Certificate of Appreciation. In our three-year partnership, BESI and Nobleo have built a strong relationship grounded in shared dedication to technical excellence. The award shows our team’s commitment to on-time delivery of precise, reliable designs and providing continuous support for BESI’s needs. From prototype development and NPI guidance with an Asian supplier to seamless integration into production. Over the past couple of years, we’ve successfully completed multiple projects, including developing entire modules for BESI’s latest hybrid bonding machines, strengthening their capabilities in advanced semiconductor technology.