Paper 13344-11
Paper 13344-11
Bonding of laser components with low outgassing adhesives
27 January 2025 • 2:20 PM - 2:40 PM PST | Moscone Center, Room 206 (Level 2 South)
Abstract
Diode lasers are vital in applications like telecommunications, medical devices, and industrial manufacturing due to their high efficiency and optical output. Combined, they are used as pump sources in fibre laser systems or solid state laser systems, enhancing performance and reliability. Combining multiple diode lasers to a high-power pump source requires specialized adhesives that ensure precision and stability of integrated optical components. Key requirements include minimal outgassing, low shrinkage, and active alignment capabilities during curing. Additionally, dual curing options (thermal and UV) increase manufacturing flexibility. These adhesives do not only bond optical components but also secure other assemblies, maintaining overall system integrity and performance.
Presenter
Thomas Ludwig
DELO Industrie Klebstoffe GmbH & Co. KGaA (Germany)
Thomas Ludwig is an accomplished mechanical engineering technician with a Bachelor’s degree, who applies his extensive technical knowledge and skills at DELO Industrie Klebstoffe. For the past two years, he has been working as an "Application Field Specialist Semiconductor Packaging" in the product management department of the company. DELO Industrie Klebstoffe is a renowned manufacturer of industrial adhesives, and Mr. Ludwig plays a central role in the development and application of adhesives for "Laser Assembly" as well as optical materials used in the wafer-level process. In his current position, Mr. Ludwig undertakes a variety of tasks where he utilizes his technical and strategic expertise to develop and implement innovative solutions for the semiconductor industry.