Paper 13344-36
Paper 13344-36
High performance EEL line beam module based on GS packaging for LiDAR applications
27 January 2025 • 3:00 PM - 3:20 PM PST | Moscone Center, Room 206 (Level 2 South)
Abstract
LiDAR based on line-beam is increasingly becoming the mainstream solution for laser radar because of its simple architecture, high reliability, regular point cloud, and smaller size. We report on an EEL chip-based line beam module packaged with GS technology. Compared to conventional COB packaging, the peak power is increased by 25%, while the junction temperature decreases by approximately 10.4°C. The module shows excellent optical performance including small SMILE resulting from the symmetrical structure and light emission from the center of a PCB.
Presenter
Hao Zhang
Focuslight Technologies, Inc. (China)
The R&D manager for the development of LiDAR transmitter module. My main research areas include VCSEL, LiDAR transmitter modules, and laser scanning devices, such as MEMS and metalenses