Paper 13344-5
Paper 13344-5
System-on-chip integration with quantum dot lasers for enhanced photonic and electronic co-packaging solutions (Invited Paper)
27 January 2025 • 10:40 AM - 11:10 AM PST | Moscone Center, Room 206 (Level 2 South)
Abstract
Integrated silicon photonics presents a promising solution to meet the increasing demands for data processing capability. However, the integration of lasers has been a challenge of system-on-chip and requires additional optimization of system layout and performance. In this work, we address this challenge through the heterogeneous integration of quantum dots (QDs) with electronic integrated circuits (EICs) and photonic integrated circuits (PICs). An optical and electrical packaging prototype is developed. Our objective is to explore the potential applications of this integration in co-packaged optics and electronics.
Presenter
Yating Wan
King Abdullah Univ. of Science and Technology (Saudi Arabia)
Dr. Yating Wan received her B.Sc. degree at Zhejiang University, in 2012, and her Ph.D. degree in at Hong Kong University of Science and Technology in 2017. Prior to joining KAUST as an Assistant Professor in 2022 summer, she was a postdoctoral scholar in Prof. John Bowers group at University of California, Santa Barbara from 2017-2022. Dr. Wan’s research interests are in Silicon Photonics with special emphasis on integration of on-chip light sources for short-reach communication links. Her research has resulted in many pioneering and cutting-edge results, receiving extensive recognition by more than 30 professional communities and 10 social media coverages. She has published more than 60 peer-reviewed research papers. She served in editorial and committee roles for prestigious journals and conferences, including Light: Science & Applications, APL Photonics, IEEE Journal of Quantum Electronics (JQE) etc.